A report by The Information claims that the world’s biggest chipmaker is considering adding memory back into its portfolio, starting with next-generation 3D DRAM.
With demand still outpacing supply and prices sky-high, the outlet says it could compete with memory giants Micron, Samsung, and SK Hynix to develop and produce 3D DRAM technology that stacks chips vertically for increased bandwidth, capacity, and power efficiency.
[Link: TSMC Weighs Making Advanced Memory Chips to Capture More AI Spending | https://www.theinformation.com/articles/tsmc-weighs-making-advanced-memory-chips-capture-ai-spending?rc=v4bmzs | The Information]
Oddly it does say “adding memory back into its portfolio” which implies that they used to do memory, so they might have mothballed facilities.
It’s still a mammoth undertaking though.
Also, if they’re already producing on-die DRAM for SoC’s then perhaps that’s their entry point.